While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.
MOUNTAIN VIEW, Calif., Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using ...
Combining GUC's rich expertise in chiplet and 3DIC technology, enables GUC to deliver comprehensive and differentiated services in next-generation system integration, pushing the boundaries of ASIC ...
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