"Chiplet stacking is a key technology for improving chip performance and cost-effectiveness. In response to the strong market demand for 3D IC, TSMC has completed early deployment of advanced ...

TSMC introduced "Wafer Manufacturing 2.0" in July ... While wafer foundries leverage their expertise in 2.5D/3D packaging to streamline processes, traditional OSAT players face challenges in ...

Hsinchu, Taiwan – May 24, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric™ advanced packaging ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.