Alchip Opens 3DIC ASIC Design Services
Proven AI and HPC ASIC Design Flow Production-ready 3DIC cross-section Alchip’s newly available 3DIC design flow addresses ...
Digi Times24d
3DIC and packaging drive AI chip innovation at SEMICON Japan 2024
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.
Datacenter Dynamics14d
Samsung’s advanced chip packaging VP Lin Jun-Cheng leaves company
Following a letter from the company’s co-CEO Jun Young-hyun apologizing for the company’s disappointing preliminary Q3 2024 ...
Design-Reuse4y
Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows
MOUNTAIN VIEW, Calif., Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using ...
Design-Reuse23d
GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
Combining GUC's rich expertise in chiplet and 3DIC technology, enables GUC to deliver comprehensive and differentiated services in next-generation system integration, pushing the boundaries of ASIC ...