While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.

Following a letter from the company’s co-CEO Jun Young-hyun apologizing for the company’s disappointing preliminary Q3 2024 ...

Combining GUC's rich expertise in chiplet and 3DIC technology, enables GUC to deliver comprehensive and differentiated services in next-generation system integration, pushing the boundaries of ASIC ...

DRC and LVS checks are performed by Synopsys IC Validator, and timing, power, and physical signoff are integrated with Synopsys 3DIC Compiler, forming a comprehensive flow for multi-die signoff.

The optimized reference flow provides a unified co-design and analysis solution, enabled by Synopsys 3DIC Compiler to accelerate exploration and development of multi-die designs at all stages from ...

Parasitic extraction (PEX) in electronic design automation (EDA) calculates parasitic effects — such as capacitances, ...

Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, and design tools. EE Herald publishes design ideas, technology trends, ...

including hybrid copper bonding for 3DIC and HBM-16H, I-CubeE, I-CubeR, and CPO. These two years have been a pleasant and meaningful journey. I would also like to thank my Samsung colleagues for ...