Proven AI and HPC ASIC Design Flow Production-readyTaipei, Taiwan, Jan. 16, 2025 (GLOBE NEWSWIRE) -- Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimen ...

Java Burn, the revolutionary new supplement, is redefining the wellness market by combining the benefits of natural ...

Proven AI and HPC ASIC Design Flow Production-ready 3DIC cross-section Alchip’s newly available 3DIC design flow addresses ...

Parasitic extraction (PEX) in electronic design automation (EDA) calculates parasitic effects — such as capacitances, ...

Following a letter from the company’s co-CEO Jun Young-hyun apologizing for the company’s disappointing preliminary Q3 2024 ...

Combining GUC's rich expertise in chiplet and 3DIC technology, enables GUC to deliver comprehensive and differentiated services in next-generation system integration, pushing the boundaries of ASIC ...

While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.

DRC and LVS checks are performed by Synopsys IC Validator, and timing, power, and physical signoff are integrated with Synopsys 3DIC Compiler, forming a comprehensive flow for multi-die signoff.

April 28, 2020-- Synopsys, Inc. (Nasdaq: SNPS) today introduced its 3DIC Compiler platform to transform the design and integration of complex 2.5 and 3D multi-die system in a package. It provides an ...

There was almost no talk of through-silicon vias, which previously had been heralded as vital to 2.5D and 3DIC packaging. Fast forward to this month’s 3D Architectures for Heterogeneous Integration ...