Fab tools are being fine-tuned for through-silicon via processes as demand ramps for everything from HBM to integrated RF, ...
The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...
Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...
A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...
A new technical paper titled “Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data ...
Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...
An Analysis of Low-Power Microcontrollers for Biomedical Applications” was published by researchers at EPFL. Abstract ...
A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging ...
A technical paper titled “Recent progress in spin-orbit torque magnetic random-access memory” was recently published by imec.
Researchers from Johns Hopkins University created a memristor effect in pentacene organic FETs. During experiments to ...
In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...
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