The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...

In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...

A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...

A technical paper titled “Recent progress in spin-orbit torque magnetic random-access memory” was recently published by imec.

An Analysis of Low-Power Microcontrollers for Biomedical Applications” was published by researchers at EPFL. Abstract ...

A new technical paper titled “Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data ...

A new technical paper titled “Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging ...

Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification” was published by researchers at Korea ...

Researchers from Johns Hopkins University created a memristor effect in pentacene organic FETs. During experiments to ...

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are ...

Automotive chips are aging significantly faster than expected in hot climates with sustained high temperatures, raising concerns about the reliability of electrified vehicles over time and whether ...