Proven AI and HPC ASIC Design Flow Production-ready 3DIC cross-section Alchip’s newly available 3DIC design flow addresses ...

April 28, 2020-- Synopsys, Inc. (Nasdaq: SNPS) today introduced its 3DIC Compiler platform to transform the design and integration of complex 2.5 and 3D multi-die system in a package. It provides an ...

While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected.

MOUNTAIN VIEW, Calif., Nov. 17, 2021 -- To strengthen innovation of complex SoCs for compute-intensive applications such as high-performance computing, AI and 5G, Synopsys, Inc. (Nasdaq: SNPS) today ...

Following a letter from the company’s co-CEO Jun Young-hyun apologizing for the company’s disappointing preliminary Q3 2024 ...